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CyberOptics SE500 3D SPI

CyberOptics SE500 is an advanced 100 % 3D solder paste inspection system that redefines the inspection speed. This system has the ability to inspect the most demanding assemblies at 70 inspection speed that does not compromise on the measurement accuracy and repeatability. With 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry.


Building on CyberOptics proven sensor technology, SE500 can inspect the pad sizes down to 01005 component size while keeping pace with the ever increasing line speeds.



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