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AIM Solder
solder materials for electronics industry
Global leader in solder technology
AIM is a leading global manufacturer of solder assembly materials for the electronics industry with manufacturing, distribution, and support facilities located throughout North and South America, EMEA, and Asia. We serve the electronics industry, as well as various specialized businesses, including LED lighting, mobile devices, automotive, renewable energy and aerospace. At AIM, we are committed to developing world class products through innovative R&D and offering unparalleled sales and technical support.
AIM Solder’s advanced line of solder assembly materials consists of a wide variety of halogen-free, tin-lead and lead-free solder, including
solder paste, liquid flux, cored wire, bar solder and more, on a global scale.
Solder Paste: M8 No Clean
M8 No Clean Solder Paste is designed for the most demanding high density electronic assemblies. Developed in combination with T4 and finer mesh lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduced voiding on QFN/BTC components while producing bright shiny solder joints. M8 leaves minimal, high purity residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.
- Halogen-free
- Low voiding on BGA and BTC components
- REACH and RoHS compliant
- For use with demanding, high density electronic assemblies
- High SIR/Electrically safe residue
- Formulated for use with T4 and finer powders
- Mitigates head-in-pillow
Liquid Flux: FX16 No Clean
FX16 No Clean Flux was engineered to provide exceptional soldering performance while leaving minimal, electrically safe flux residues, even when unheated.
FX16 is ideally formulated for point-to-point selective soldering and palletized wave soldering.
FX16 provides fast wetting and PTH barrel fill and reduces common soldering defects such as bridging, flagging and solder balls.
FX16 has a durable activation system that can withstand high process temperature required for thermally demanding applications and extended solder contact time.
- Halide/Halogen-Free
- ROL0 Per IPC J-STD-004A/B
- Low Post Process Residues
- Fast Wetting with All Leaded and Lead-Free Alloys
- IPC-A-610F Compliant
- High SIR Performance
- Broad Process Window
AIM is The Best Choice for High Reliability Soldering Applications
REL61™ and REL22™ lead-free solder alloys have been developed to meet the demands of an evolving solder market. Greater durability, lower costs and lower processing temperature are key drivers and AIM REL61 and REL22 provide assemblers with new tools to improve product quality the assembly process. REL alloys have demonstrated reduced tin whisker formation as well as outperforming SAC alloys in thermal shock, vibration and drop shock resistance, making these alloys the ideal choice for all electronics applications. Available in bar solder, wire solder, solder paste.
REL61 Lead-Free Solder Alloy
REL61 is ideally suited for competitive industries which need a lower cost, enhanced durability alloy. REL61 has repeatedly demonstrated reliability gains over SAC305 and other low/no silver alloys in thermal cycling performance such as LED lighting, in-cabin automotive electronics and high power applications. REL61 provides the electronics assembly marketplace a low cost alternative to SAC alloys that has the reliability and performance characteristics equal to or greater than SAC305 and other low/no-silver solder alloys.
REL22 Lead-Free Solder Alloy
REL22 has also been developed to provide PCB designers and assemblers with the most durable alloy option possible. REL22 has demonstrated twice the durability of SAC305 in thermal cycling and mechanical performance. REL22 addresses production quality issues associated with similar alloys including Sn/Ag/Bi/Sb/Ni/Cu, such as pin-holes on SMT solder joints and voiding on BTC components. Testing demonstrates that REL22 is well suited to extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace and other severe operating environments. The low creep rates exhibited by REL22 make it ideal for applications where thermal shock, vibration and high g-forces are experienced.
Visit AIM Solder website aimsolder.com