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PARMI
Total 3d inspection solutions for smt/THT/semiconductor
high Speed Programming
Founded in 1998, PARMI has always been synonymous with innovation. They are not just another SPI & AOI solutions provider, but a true solutions partner with a goal to add value to your business. Whether we are helping you increase your PCB yield and throughput, solve a unique challenge, or increase your ROI, PARMI systems give you a competitive edge.
PARMI in-line 3D inspection machines are suited for discerning users who require ‘Smart Inspection’ techniques, that give them clear, accurate, repeatable and fast results, whatever the application: from SMT manufacturing to semiconductor processes.
The new generation Xceed 3D AOI (Automated Optical Inspection) and their SIGMAX 3D SPI (Solder Paste Inspection) systems are equipped with a shadow-free, dual-laser optical triangulation measuring principle, with high speed CMOS4 mega pixel camera, which ensures an industry leading world class performance. The advantage of a simple user interface and ease of programming, guarantees an effective quality gate in identifying all defects.
sigmaX 3D SPI
Solder Paste Inspection is an important process to check the solder paste deposited in the assembled PCB manufacturing process. Observation tells us that most of the solder joint defects in a PCB assembly are because of failures in solder paste printing. With the help the SIGMAX solder paste inspection (SPI), our customers can reduce the defects related to soldering considerably.
The SIGMA X has two laser beams that project from opposite directions to eliminate the risk of shadowing. The beams are then scanned onto the PCB and reflected back to a high-resolution camera (CMOS) to calculate height with X-Y spatial resolution. The result is a highly- accurate 3D model construction. This Multiple Profile Correlation (MPC) is a PARMI exclusive, and provides realistic and easy-to-interpret 3D images without distortion.
Xceed 3D AOI
The Parmi Xceed New Generation 3D AOI range of systems can detect all defect types that relate to component placing and soldering. Its high speed CMOS camera with dual-laser technology can easily identify missing, lifted, misaligned and tomb-stoned components as well as check polarity of all devices.
The best in 3D AOI systems. Whether we are helping you increase your PCB yield and throughput, solve a unique challenge, or increase your ROI, Parmi systems give you a competitive edge. Parmi have developed their new generation Xceed 3D AOI to improve your processes and product quality in terms of component placing and soldering quality.
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