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HOME » PRODUCTS» CYBEROPTICS

The Company's SMT inspection system products are used in the SMT electronic assembly industry for process control and inspection. These 
systems are sold directly to end user manufacturing customers that use them in a production line or along-side the line to maintain process and 
quality control. CyberOptics offers a range of 2D and 3D SPI products, such as SE600 and SE500ULTRA. 

CyberOptics’ AOI systems are designed for both pre-reflow and postreflow inspection covering a comprehensive list of component and solder 
joint defect categories and are fully capable of inspecting 01005 components and beyond. 
The SIM (Strobed Inspection Module) is at the core of every CyberOptics’ AOI system. Designed and manufactured exclusively by CyberOptics, the calibration-free SIM enables on-the-fly inspection at 200cm2/sec – making our AOI systems the fastest in the world.

The SQ3000 is an all-in-one solution that’s loaded with powerful tools that cover inspection and measurement for AOI, SPI & CMM applications.

SE500 ULTRA
The SE500ULTRA™ system is power-packed with 30% more speed, newly designed V5 series software enabling world class user experience and optional dual illumination sensor. 
 
An all-new, improved ultrafast sensor combined with a unique ‘all-in-one’ scan technique – that integrates fiducial, barcode and range scans into one, seamless scan sequence – makes the SE500ULTRA 30% faster at 210cm²/sec. 
You can choose the Dual Illumination sensor option for best repeatability and reproducibility results – even on the smallest paste deposits. 

Key Features & Benefits 
  • All-new, Ultrafast sensor with calibration-free design 
  • 30% faster with unique ‘all-in-one’ scan sequence 
  • New, Intuitive Touch Screen Interface with World-class Usability 
  • Improved Repeatability with Dual Illumination Sensor Option 
  • Closed Loop Printer Feedback Ready 
  • CyberPrint OPTIMIZER™ Ready 
  • Mounter Feed Forward Ready 

SE600
The SE600™ – CyberOptics’ flagship SPI system, is the most advanced, high performance system ever. SE600™ brings together best accuracy and world-class usability on a single platform – making it the most ideal inspection solution for automotive, medical, military and other top niche markets. 
 
SE600™ comes with a standard dual illumination sensor designed to offer the best GR&R results – even on the very smallest of paste deposits. 
The award-winning new SPIV5 software offers revolutionary features that enable incredibly smarter and faster inspection. 

Key Features & Benefits  
  • Ultimate Precision Accuracy 
  • State-of-the-art Dual Illumination Sensor enabling ‘true’ height measurement with shadow-free imaging 
  • High speed inspection with peak 108 cm²/sec speed (avg 80cm²/sec) 
  • Award-winning, Newly Designed Software 
  • Multi-touch Intuitive Software Enabling Shortest Learning Curve 
  • Closed Loop Feedback Ready 
  • CyberPrint OPTIMIZER™ Ready 
  • Mounter Feed Forward Ready

SE 3000 3D SPI
Maximize yields with the World’s First SPI system incorporating the MRS Sensor technology. When only the very best will do. 
 
The new SE3000 3D SPI system is the world’s first SPI system to incorporate the industry-leading Multiple-Reflection Suppression (MRS) technology with a finer resolution for the best accuracy, repeatability and reproducibility – Even on the smallest paste deposits. Combined with the award-winning, easy-to-use SPI software, solder paste inspection has reached a new level of precision for the most stringent requirements. 
 
SE3000-DD Dual Lane, Dual Sensor system and SE3000-X also available.

MRS Technology for 3D SPI 
CyberOptics’ unique sensor architecture with 4 multi-view 3D sensors and a parallel projector, simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together, delivering metrology grade accuracy at production speed.
QX150 Desktop AOI
The QX150™ is powered by an all-new SIM (Strobed Inspection Module) with enhanced illumination – designed to deliver true, in-line inspection performance. The SIM enables on-the-fly inspection making the QX150™ the fastest tabletop ever at 150 cm²/sec. A higher sensor resolution (12µm) offers superior quality images for more accurate defect review. And, as always, the SIM is calibration-free. 
 
The QX150™ delivers quick setup and fast programming with AI² (Autonomous Image Interpretation) technology. A dramatic 90 percent reduction in examples and full support for unsupervised and semi-automatic model training means significantly lower tuning time and quality results with a single panel inspection. Perfect for those high-mix, low-volume applications! 
 
QX150™ also offers 100% program compatibility with all QX inline AOI systems.

Key Features & Benefits 
  • UV Strobed Inspection Module World’s fastest tabletop at 150 cm²/sec 
  • UV illuminationTrue, in-line inspection capability with all-new SIM (Strobed Inspection Module) 
  • Higher resolution Higher resolution (12µm) for superior quality images 
  • Quick Setup Quick setup and fast programming with AI² technology 
  • Lowest false Call Rate Lowest false call rate and zero escapes 
  • AOI systems 100% program compatibility with CyberOptics’ in-line systems
QX150i
The QX150i™ AOI system offers high value and high flexibility for all applications and is ideally suited for pre-reflow and selective solder inspection. The Strobed Inspection Module (SIM), the core engine behind QX150i™, enables on-the-fly inspection assuring a fast and smooth process. 
 
AI² (Autonomous Image Interpretation) technology on QX150i™ ensures ultrafast programming and is capable of getting you from zero to production ready in less than 13 minutes*. Powered by an 80 megapixel sensor, QX150i™ significantly improves solder joint and 01005 inspection performance and provides crisp images for more accurate defect review. The system is also designed to provide easy wedge-in replacement of existing conveyor. 
 
Key Features & Benefits 
  • Pre-FlowIdeal for Pre-Reflow and Selective Solder Applications 
  • Capability01005 Inspection Capability 
  • ReplacementEasy Wedge-in Replacement of Existing Conveyor 
  • FastFastest Programming with AI² in <13 minutes
QX600
The QX600™ is designed with an all-new SIM (Strobed Inspection Module) with enhanced illumination – delivering the best 01005 and solder joint inspection performance ever. 
 
With a higher sensor resolution (12 µm), you get to see crisp, perfect quality images for more accurate defect review. 
 
QX600 is equipped with SAM (Statistical Appearance Modeling) vision technology to give you the power to inspect ‘anything’ while keeping programming extremely simple – no algorithms to tune or parameters to adjust. SAM works in perfect harmony with AI² (Autonomous Image Interpretation) technology to enable fast programming and reliable discrimination against defects. 

Key Features & Benefits  
  • All-new SIM (Strobed Inspection Module) with Enhanced Illumination 
  • Higher Resolution (12 µm) for perfect, crisp quality images 
  • Production Ready in <13 minutes* with AI² 
  • 01005 Inspection Capability 
  • Improved Solder Joint and Gold Finger Inspection 
  • Lowest False Call Rate and Zero Escapes 
    *for pre-defined parts 
QX3000
SQ3000 3D Automated Optical Inspection (AOI) system maximizes ROI and line utilization with 3D multi-view sensors that enable fastest 3D inspection in the industry. SQ3000 incorporates Multi-Reflection Suppression technology (MRS) and highly sophisticated 3D algorithms offering microscopic image quality at production speeds. SQ3000-X offers expanded capabilities supporting large boards up to 710 x 620 mm, inspecting the most demanding assemblies without compromising measurement accuracy and repeatability. 
 
MRS technology suppresses any reflections that can distort the data, especially on shiny components, enabling precise 3D representation while the architecturally superior sensor design captures and transmits data simultaneously and in parallel. The result is unmatched speed and accuracy.

Key Features & Benefits  
  • Fastest 3D inspection in the industry with architecturally faster 3D sensor 
  • Microscopic image quality at production speed enabled by Multi-Reflection Suppression (MRS) technology 
  • Inhibits reflection issues with MRS technology 
  • Generates high precision images of entire PCB in full color with 3D image fusing algorithms 
  • Large board capability with SQ3000-X 
  • Simpler and faster inspection with AI² technology using 2D/3D images 
  • Delivers precision accuracy, GR&R and lowest false call rates 
  • Accurate pin height/package coplanarity measurement 
  • Easy-to-use with simple intuitive interface and touch control 
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